Description :
General Specifications | ||||||||||
Platform | Desktop | |||||||||
Market Segment | Enthusiast Desktop | |||||||||
Product Family | AMD Ryzenâ„¢ Processors | |||||||||
Product Line | AMD Ryzenâ„¢ 7 Processors | |||||||||
AMD PRO Technologies | No | |||||||||
Consumer Use | Yes | |||||||||
Regional Availability | Global | |||||||||
Former Codename | “Raphael AM5” | |||||||||
Architecture | “Zen 4” | |||||||||
# of CPU Cores | 8 | |||||||||
Multithreading (SMT) | Yes | |||||||||
# of Threads | 16 | |||||||||
Max. Boost Clock | Up to 5.4GHz | |||||||||
Base Clock | 4.5GHz | |||||||||
L1 Cache | 512KB | |||||||||
L2 Cache | 8MB | |||||||||
L3 Cache | 32MB | |||||||||
Default TDP | 105W | |||||||||
Processor Technology for I/O Die | TSMC 6nm FinFET | |||||||||
CPU Compute Die (CCD) Size | 71mm² | |||||||||
I/O Die (IOD) Size | 122mm² | |||||||||
Package Die Count | 2 | |||||||||
Unlocked for Overclocking | Yes | |||||||||
AMD EXPOâ„¢ Memory Overclocking Technology | Yes | |||||||||
Precision Boost Overdrive | Yes | |||||||||
Curve Optimizer Voltage Offsets | Yes | |||||||||
AMD Ryzenâ„¢ Master Support | Yes | |||||||||
CPU Socket | AM5 | |||||||||
Supporting Chipsets | X670E | |||||||||
X670 | ||||||||||
B650E | ||||||||||
B650 | ||||||||||
CPU Boost Technology | Precision Boost 2 | |||||||||
Instruction Set | x86-64 | |||||||||
Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 | |||||||||
Thermal Solution (PIB) | Not included | |||||||||
Max. Operating Temperature (Tjmax) | 95°C | |||||||||
Launch Date | 9/27/2022 | |||||||||